The development of low-loss capacitor material by ECC Labs has enabled embedded low-loss (RF) capacitors. The technology can replace discrete RF capacitors as well as integrated RF capacitors on wafers. This new dielectric material and stack-up allows designing multilayer RF capacitors into PCBs and substrates. The presentation will illustrate details of the material’s key characteristics, electronic performance, process handling, and application examples.

CadenceLIVE Silicon Valley 2024 will be held on April 17 at the Santa Clara Convention Center. It features peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products. CadenceLIVE brings together users, developers, and industry experts to connect, share ideas, and inspire design creativity. Attendees have the opportunity to attend captivating keynotes and interesting user presentations and interact with Cadence experts, peers, and our sponsors in our Designer Expo.

Join us to learn how you can structure a modern CAD library and what parameters are required to make informed part decisions throughout your schematic design.