What's New

Easily and quickly identify coupling issues without always having to rely on the SI expert.

Identify and fix crosstalk issues in real-time without ever leaving your PCB design environment.

Double check your DFM rules before signoff with a forced batch check of all rules for your whole design. If you do find something awry, it’s easy to locate and fix in your design.

Easily ensure test points are accessible in your designs.

Check for common copper and component spacing issues that could potentially derail manufacturing and cause a respin.

Easily create and assign constraints for manufacturing based on IPC standards and common PCB rules.

Measure from true signal origin to end point through vias and through packages, not just the etch, so you can get timing right and ensure signal performance.

Visual indicators of length constraints help you meet delay propagation and total etch length goals when placing components.

Real-time interactive checks help you easily find and fix common route quality issues that manufacturing DRC signoff checks miss.

Remove unused sections of plated through holes in high-speed designs to improve signal integrity on your designs.

Easily and quickly identify impedance discontinuity issues visually, without simulation models or extensive signal integrity expertise.

Easily identify nets with inconsistencies between the signal and return paths and quickly find the cause in real-ime while you design without waiting for the SI engineer to perform analysis and...