How to Reduce Power Starvation and Hot Spots

September 24, 2021

With fine pitch high-density components, the close proximity of vias due to shrinking designs and less copper, issues with current flow are becoming increasingly prevalent. Too little current can result in power starvation, shortening the life cycle of the product. While too much current can create hot-spots and overheating in certain areas of the design. With Sigrity, achieve uniform current flow throughout your PCB, saving countless hours troubleshooting in the lab.

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