IC Packaging - More Than an Enclosure

Although the IC package design is the last stage of a components fabrication, the correct design is essential to its performance. In this webinar, our experts will discuss key features to consider when designing your IC package, common challenges you may face, and demonstrate how complete chip to package to board flow can make the design process easier. Join us to learn why the design of a components package is critical and more than just an enclosure.

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Accelerating Your Design With Component Information Management
Accelerating Your Design With Component Information Management

Managing component information becomes more and more complex as our libraries grow over time. Join us for a...

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Virtual Prototyping using Electromagnetic Simulation for Connected Devices
Virtual Prototyping using Electromagnetic Simulation for Connected Devices