Sigrity technologist Brad Brim guides you step by step on how to perform full-wave 3D extraction on the right slice of a PCB or IC Package design. He shares his insights in how to use different field solvers to qualify your “area of interest” and then apply Cadence 3D full-wave technology to produce an accurate interconnect model in a fraction of the time spent using other solutions where the problem may not have been so strategically bounded.