Taking Arm Neoverse into 3D with Digital Full Flow
A comprehensive study on a signoff quality physical design of a 3D high-performance microprocessor, Neoverse N1 CPU, using face-to-face (F2F)
Introducing the Integrity 3D-IC Platform for Multi-Chiplet Design
The Cadence® Integrity™ 3D-IC Platform is the new high-capacity, unified design and analysis platform for designing multiple chiplets.
John Park's Webinar on Chiplets
Recently Cadence's John Park presented a webinar on Design Methodologies for Next-Generation Advanced Multi-Chip(let) Packaging.
EDPS: When Chips Become 3D Systems and the Challenges of 3DHI
John Park's opening slide sums up what seems to be the current situation. Simply following Moore's Law alone is no longer the best technical and economical path forward.
Security for IoT Is a Requirement, Not a Choice
It is hard to attend any sort of meeting to do with semiconductors without hearing about the Internet of Things (IoT), and probably the hottest subtopic is IoT security. Some devices will contain...