Cadence System Analysis

Today’s modern electronic designs require more functionality and performance than ever to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very challenging.

Series resistors and RC termination circuits can slow down a signal by acting as a low-pass filter.

Make sure you know how to use thermal interface materials in your PCB to direct heat dissipation in electronics.

Learn why phased array antennas are used in a variety of applications such as wireless communication systems, 5G technologies, and radar systems.

Learn more about planar waveguides and why they are often chosen for optical sensor applications.

Learn why battery cooling systems in electric vehicles are so critical in our brief article.

Learn about how thermal shock testing and thermal cycling testing differ in this article.

Learn about the benefits and applications of automotive millimeter-wave radar in our brief article.

Learn about the different antenna measurement methods engineers can use to conduct antenna measurements to ensure antennas meet the necessary specifications.

Learn more about the types of recombination in semiconductors, including radiative and non-radiative recombination.

Learn about the different types of channel crosstalk affecting wave division multiplexing systems.

Learn about the thermal resistance of convection as well as the different types of convection in our brief article.

Learn more about direct and inverse problem approaches to electromagnetic actuator design in our brief article.

The Ka-band frequency offers many advantages for use in military forces, radars, aircraft, radio communications, and satellite communications.

Learn how crosstalk in computer networks affects their ability to provide reliable and efficient communication.

In the electronics industry, the application of numerical methods in heat transfer problems helps engineers develop efficient thermal management techniques.

Learn more about non-resonant and resonant antennas in our brief article.

Thermal resistance is the measure of the ability of an IC package to transfer heat from the junction to the package and then to the ambient.

The application of symmetric boundary conditions in FEA reduces the model size and makes FEA simpler than full model FEA.