Cadence PCB Solutions

Power supply design for embedded systems requires some knowledge of the hardware and software components that support the device.

Learn how QFN package thermal resistance supports high power applications.

Learn how to create a basic linear power supply design, including applications and design tips.

DC power supply design basics include some of the forks in topology, such as linear versus switched mode power supply and isolation versus non-isolation.

Electronic product design and development is financially motivated by any moderate-and-up PCB lot size and operates by minimizing cost incrementally.

Two types of optical isolators – optocouplers and optotriacs – are discussed in this guide.

Skew in an SMD component originates from uneven solder temperature distribution across SMD pads. Learn about how to overcome these problems in this article.

Via-in-pad is required when densities get very high in a PCB layout. Learn more about when to use via-in-pad and overcome some myths about this design practice.

IoT networking components are a delicate balance between different (often contradictory) design choices and performance must be analyzed from multiple angles.

Electrolytic capacitor use is very similar to standard capacitor use; however, electrolytic capacitors are more volumetrically-efficient sources of capacitance.

Learn more about the QFN package process flow, including its advantages and types.

Here we dive deep into Thevenin's theorem, including use cases, how to apply it, and its limitations.

Here are some Ka-band radar frequency applications you should know about.

Reliability assurance is a necessary feedback tool for layout and manufacturing to design and build durable, long-lasting boards.

Utilizing intelligent CAD software with DFA and DFM capabilities plays an important role in product design for manufacture and assembly.

Here we compare vulnerability assessment vs. penetration testing for hardware systems and discuss potential sources of vulnerabilities.

MOSFETs being used in power electronics have a safe operating area for DC and pulse currents.

Solder mask dam sizes used in a PCB must have some minimum size in order to be effective. This will relate to the lead pitch on SMD components.

MOSFETs, JFETs, HEMTs, and MESFETs are four types of FETs